| 摘要 |
PROBLEM TO BE SOLVED: To prevent a semiconductor chip from cracking when it is picked up. SOLUTION: When a semiconductor chip 15 stuck to a sheet 12 is picked up, only a sheet 12 where the semiconductor chip 15 being picked up is located is irradiated intensively with UV-rays. More specifically, UV-rays are irradiated from a push-up collet 16 located below the semiconductor chip 15. Consequently, only the semiconductor chip 15 being picked up can be stripped surely from the sheet 12. Furthermore, other semiconductor chips 15 not to be picked up can be sustained in a state stuck to the sheet 12. COPYRIGHT: (C)2006,JPO&NCIPI |
