| 摘要 |
PROBLEM TO BE SOLVED: To provide a positioning method of a semiconductor wafer that determines the handling position of the semiconductor wafer having a discontinuous part at its rim, and to provide a device using the method. SOLUTION: A holding stage 7 with the semiconductor wafer W held is rotation-scanned with the optical power of the predetermined wavelength according to the type of the protective tape adhered to the surface of the semiconductor wafer W adjusted by a controller 21. In this bout, at the positioning V-notch part formed in the wafer W, the light is transmitted from the protective sheet covering the surface and received by a light receiving sensor 21. A position of a detected area is identified on the basis of a variation in the amount of light received by the light receiving sensor 21. COPYRIGHT: (C)2006,JPO&NCIPI |
