| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems that there is lengthened recovery time till wafer W temperature reaches predetermined temperature in a state where a temperature difference in a wafer W plane is large when the wafer is placed on a heating surface of a wafer heating apparatus, so that the temperature in the wafer W plane is not uniform and can not be raised in a short time. SOLUTION: A heater comprises a plate shaped body 2; a first resistance heater 5a disposed inside the plate shaped body 2 and at a central portion of one principal surface; and a second resistance heater 5b disposed within an annular zone provided circumferentially, and separated from the first resistance heater 5a. Herein, a resistance value of the first resistance heater 5a is larger than that of the second resistance heater 5b. COPYRIGHT: (C)2006,JPO&NCIPI
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