| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper polyimide substrate suitable for forming a fine pattern and having a small copper thickness with high productivity. SOLUTION: In the method for manufacturing a copper polyimide substrate, the surface of a polyimide resin film is made hydrophilic, a physical development core layer is provided, a silver film is formed according to a silver diffusion transfer process, and then copper plating is carried out. COPYRIGHT: (C)2006,JPO&NCIPI
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