发明名称 Honeycomb structure
摘要 <p>There is disclosed a honeycomb structure in which a crack due to a thermal shock is not easily generated and in which a crack is not easily developed entirely even if the crack is generated. A honeycomb structure 100 includes: partition walls 1 formed so as to define a plurality of cells 8 whose section perpendicular to an axial direction is quadrangular and which extend in an axial direction; and an outer peripheral wall 2 which surrounds the partition walls 1, and an average value (Ts) of outer peripheral wall thicknesses is Tp < Ts ‰¤ 10 × Tp (Tp: average value of partition wall thicknesses), and the outer peripheral wall thickness in a specific position is set to be smaller than that in another position. An average value (Tp) of partition wall thicknesses is preferably 0.038 mm ‰¤ Tp ‰¤ 0.43 mm.</p>
申请公布号 EP1698397(A1) 申请公布日期 2006.09.06
申请号 EP20060251110 申请日期 2006.03.01
申请人 NGK INSULATORS, LTD. 发明人 AOKI, TAKASHI
分类号 B01J35/04;B01D39/20;B01D53/94;C04B38/00;F01N3/022;F01N3/28 主分类号 B01J35/04
代理机构 代理人
主权项
地址