| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to connect favorably a conductor wiring layer on the surface of a low-temperature fired glass ceramic board, which is used for a hybrid IC, a multi-chip module or the like, with a connection via hole, which is formed using an Ag conductor, without generating a defective connection or the like between the conductor wiring layer and the connection via hole. SOLUTION: A glass ceramic multilayer board is constituted into a structure, wherein a plurality of conductor wiring layers and a plurality of glass ceramic insulating layers are alternately laminated on a glass ceramic board and at the same time, the wiring layers are made a conductive connection with each other via connection via holes consisting of an Ag conductor and at least the conductor wiring layer, which is provided on the surface of the ceramic board, consists of one kind or more of an element or elements selected from among elements of Au, Pd and Pt or one kind or more of an element or elements selected from among elements of Au, Pd and Pt and an Ag alloy, and in the glass ceramic multilayer board, the connection via holes, which connect the conductor wiring layer, which is provided on the surface of the glass ceramic board, with the other conductor wiring layers, are constituted of Ag and a nickel oxide. The weight ratio of the Ag to the nickel oxide is set within a range of the ratio of Ag/NiO of 98/2 to 80/20. |
