发明名称 |
Wire bonder and testing method for wire bonds |
摘要 |
<p>A bonding wire (15) is fixedly gripped by a wire clamp (13). The bonding head (3) or the wire clamp is raised to a specific distance, so as to measure the tensile force acting on the wire by using a strain gauge (23) connected to a tensile force evaluation unit (29). <??>An Independent claim is also included for wire bonder.</p> |
申请公布号 |
EP1310319(B1) |
申请公布日期 |
2006.09.06 |
申请号 |
EP20010126621 |
申请日期 |
2001.11.07 |
申请人 |
F & K DELVOTEC BONDTECHNIK GMBH |
发明人 |
FARASSAT, FARHAD, DR. |
分类号 |
B23K20/00;H01L21/60;B23K31/12;G01N19/04;H01L21/66 |
主分类号 |
B23K20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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