发明名称 Wire bonder and testing method for wire bonds
摘要 <p>A bonding wire (15) is fixedly gripped by a wire clamp (13). The bonding head (3) or the wire clamp is raised to a specific distance, so as to measure the tensile force acting on the wire by using a strain gauge (23) connected to a tensile force evaluation unit (29). <??>An Independent claim is also included for wire bonder.</p>
申请公布号 EP1310319(B1) 申请公布日期 2006.09.06
申请号 EP20010126621 申请日期 2001.11.07
申请人 F & K DELVOTEC BONDTECHNIK GMBH 发明人 FARASSAT, FARHAD, DR.
分类号 B23K20/00;H01L21/60;B23K31/12;G01N19/04;H01L21/66 主分类号 B23K20/00
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