| 发明名称 |
IC CHIP MOUNTING BODY MANUFACTURING METHOD AND MANUFACTURING DEVICE |
| 摘要 |
A film substrate that has antenna circuits formed at a fixed spacing on one surface thereof is transported at a constant speed, and IC chips are moved along the film substrate, and are mounted at the fixed spacing on the film substrate so as to be connected to the antenna circuits. |
| 申请公布号 |
EP1699078(A1) |
申请公布日期 |
2006.09.06 |
| 申请号 |
EP20040807590 |
申请日期 |
2004.12.22 |
| 申请人 |
SHINKO ELECTRIC CO., LTD |
发明人 |
INOUE, TAICHI;ARIMA, SUMIHIRO;NAGANO, KAZUTAKA;MORITA, MASASHI |
| 分类号 |
G06K19/077;H01L21/60;B42D15/10;G06K19/00;G06K19/07;H01L21/00;H01L21/52;H01L23/498 |
主分类号 |
G06K19/077 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
