发明名称 PROCESS FOR FORMING A PATTERNED THIN FILM STRUCTURE FOR IN-MOLD DECORATION
摘要 <p>A process for forming a patterned thin film structure on a substrate or in-mold decoration film is disclosed. A pattern is printed with a material, such as a masking coating or ink, on the substrate, the pattern being such that, in one embodiment, the desired structures will be formed in the areas where the printed material is not present, i.e., a negative image of thin film structure to be formed is printed. In another embodiment, the pattern is printed with a material that is difficult to strip from the substrate, and the desired thin film structures will be formed in the areas where the printed material is present, i.e., a positive image of the thin film structure is printed. The thin film material is deposited on the patterned substrate, and the undesired area is stripped, leaving behind the patterned thin film structure.</p>
申请公布号 EP1697102(A2) 申请公布日期 2006.09.06
申请号 EP20040784783 申请日期 2004.09.16
申请人 SIPIX IMAGING, INC. 发明人 CHAUG, YI-SHUNG;WANG, XIAOJIA;KILUK, SEAN;TSENG, SCOTT;ZANG, HONGMEI;LIANG, RONG-CHANG
分类号 B29C31/00;B29C;B41M1/30;C23C14/04;C23C14/08;C23C14/20;G02F1/1343;H01L51/00;H05K3/04;H05K3/14;H05K3/16;H05K3/18;H05K3/38 主分类号 B29C31/00
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