Printed circuit board with embedded capacitors therein and manufacturing process thereof
摘要
<p>Disclosed is a printed circuit board (101) having embedded capacitors therein, comprising: a double-sided copper-clad laminate including first circuit layers formed in the outer layers (102) thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers (105) formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers (106) formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates (108;109) formed on the second circuit layers; blind via-holes (111) and through-holes (110) formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes (111) and the through-holes (110). The manufacturing method of the printed circuit board is also disclosed.</p>
申请公布号
EP1699275(A2)
申请公布日期
2006.09.06
申请号
EP20060004062
申请日期
2006.02.28
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD
发明人
AHN, JIN YONG;HWANG, CHEOL SEONG;KIM, SUNG KUN;RYU, CHANG SUP;CHO, SUK HYEON;JEON, HO SIK