| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet for manufacturing a semiconductor device capable of improving the mounting strength of a semiconductor device such as a resulting QFN onto a wiring board etc. and of improving the mounting reliability without causing the possibility of resin leakage and of paste being left behind when manufacturing the semiconductor device such as the QFN. <P>SOLUTION: The adhesive sheet 10 for manufacturing a semiconductor device has an adhesive layer 12 on one surface of a heat resistant substrate 11, and is stuck on a lead frame or a wiring board freely to be peeled off. The adhesive layer 12 contains at least (a) a thermosetting resin and (b) an exfoliative property imparting component. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
