发明名称 |
Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby |
摘要 |
<p>A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230 DEG C, and then mixing the component (A) and remaining components with the resulting mixture. <IMAGE></p> |
申请公布号 |
EP1538182(B1) |
申请公布日期 |
2006.09.06 |
申请号 |
EP20040027559 |
申请日期 |
2004.11.19 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
TOYODA, EIJI;OKADA, TAKESHI;YOSHIKAWA, KEISUKE;ETO, TAKUYA;IKEMURA, KAZUHIRO;AKIZUKI, SHINYA;ISHIZAKA, TSUYOSHI;UCHIDA, TAKAHIRO;TOYOTA, KEI |
分类号 |
C08L63/00;C08G59/00;C08G59/18;C08G59/62;C08G59/68;C08L61/04;C08L61/06;H01L23/29;H01L23/31 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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