发明名称 |
Resilient polishing pad for chemical mechanical polishing |
摘要 |
A resilient, laminated polishing pad for chemical mechanical polishing is disclosed. The polishing pad includes a base layer and a polishing layer bonded by a hot-melt adhesive. The hot-melt adhesive of the present invention provides a Tpeel strength for the polishing pad of at least greater than 40 Newtons at 305 mm/min, reducing pad delamination.
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申请公布号 |
US7101275(B2) |
申请公布日期 |
2006.09.05 |
申请号 |
US20030673002 |
申请日期 |
2003.09.26 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. |
发明人 |
ROBERTS JOHN V. H.;VESIER LAURENT S. |
分类号 |
B24B33/00;B24B37/00;B24B29/00;B24B37/04;B24D13/14;H01L21/304 |
主分类号 |
B24B33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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