发明名称 |
COB package type bi-directional transceiver module |
摘要 |
A COB (Chip On Board) package type bi-directional transceiver module is disclosed to include a photosensitive member bonded to a printed circuit board by COB (Chip On Board) package and adapted for receiving a first optical signal, and a light source installed by TO-can package and adapted for transmitting a second optical signal.
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申请公布号 |
US7103238(B2) |
申请公布日期 |
2006.09.05 |
申请号 |
US20040845157 |
申请日期 |
2004.05.14 |
申请人 |
RADIANTECH, INC. |
发明人 |
SHYU HAUEN CHYUN;GUAN YAW-YEU |
分类号 |
G02B6/12;G02B6/34;G02B6/42;H01L31/02;H01L31/0203;H04B10/00 |
主分类号 |
G02B6/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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