| 摘要 |
A method of preparing an integrated circuit module for attachment to a PC substrate. At least one uncased semiconductor die is affixed to a TAB tape frame having concentrically arranged an outer conductive test pad footprint, and an intermediate bond pad footprint. Conductive traces connect the bond pads individually to test pads and to ball grid array pads on the TAB tape within the confines of the bond pad footprint. Wire bonds connect input/output points of the die to the bond pads The die and the wire bonding are next overmolded with a plastic forming a cased integrated circuit module. Testing and burn-in of the module is achieved by connecting test probes to the test pads After the test and bum-in step, the integrated circuit module is cut free from the TAB tape frame for attachment to a PC board, via the ball grid array. |
