发明名称 Backplane system having high-density electrical connectors
摘要 A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.
申请公布号 US7103753(B2) 申请公布日期 2006.09.05
申请号 US20030402962 申请日期 2003.04.01
申请人 SILICON BANDWITH INC. 发明人 CRANE, JR. STANFORD W.
分类号 G06F15/00;G06F1/18;G06F13/00;G06F13/14;G06F13/40;G06F15/76;G06F15/78;H01R12/16;H01R33/00;H05K1/00;H05K1/14;H05K7/10;H05K7/14;H05K7/18 主分类号 G06F15/00
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