发明名称 |
Method of producing a contact system on the rear of a component with stacked substrates |
摘要 |
The present invention relates to a process for making a contact point ( 8 ) on the rear surface of a component including at least one first substrate ( 10 ) with at least one active region ( 12 ) and at least one second substrate ( 20 ) for protecting the active region. In accordance with the invention, a second substrate of a non-insulating material is used and at least one through insulation trench ( 21 ) is made in it surrounding a part ( 22 ) of this substrate, said part being in contact with the active region when the first and second substrates are assembled. Application to sensor conditioning.
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申请公布号 |
US7101773(B2) |
申请公布日期 |
2006.09.05 |
申请号 |
US20040490468 |
申请日期 |
2004.03.23 |
申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE |
发明人 |
DANEL JEAN-SEBASTIEN |
分类号 |
H01L21/30;G01P15/08;H01L21/48;H01L21/60;H01L23/498 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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