发明名称 Method of producing a contact system on the rear of a component with stacked substrates
摘要 The present invention relates to a process for making a contact point ( 8 ) on the rear surface of a component including at least one first substrate ( 10 ) with at least one active region ( 12 ) and at least one second substrate ( 20 ) for protecting the active region. In accordance with the invention, a second substrate of a non-insulating material is used and at least one through insulation trench ( 21 ) is made in it surrounding a part ( 22 ) of this substrate, said part being in contact with the active region when the first and second substrates are assembled. Application to sensor conditioning.
申请公布号 US7101773(B2) 申请公布日期 2006.09.05
申请号 US20040490468 申请日期 2004.03.23
申请人 COMMISSARIAT A L'ENERGIE ATOMIQUE 发明人 DANEL JEAN-SEBASTIEN
分类号 H01L21/30;G01P15/08;H01L21/48;H01L21/60;H01L23/498 主分类号 H01L21/30
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