发明名称 |
Polishing apparatus including turntable with polishing surface of different heights |
摘要 |
A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface regions of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projection region is determined on the basis of an area in which the projecting region acts on the workpiece.
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申请公布号 |
USRE39262(E1) |
申请公布日期 |
2006.09.05 |
申请号 |
US20020821046 |
申请日期 |
2001.03.30 |
申请人 |
EBARA CORPORATION |
发明人 |
HIROSE MASAYOSHI;SASAKI YOSHIMI;OGATA AKIRA;ISHIKAWA SEIJI;TAKAHASHI TAMAMI;HIYAMA HIROKUNI;WADA YUTAKA |
分类号 |
B24B29/02;B24B37/04;B24D13/14 |
主分类号 |
B24B29/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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