发明名称 |
Polishing head and chemical mechanical polishing apparatus |
摘要 |
An apparatus for polishing chemically and mechanically a wafer includes a membrane supporter and a membrane. The membrane has a pressure portion that is divided into a plurality of regions, and a partition portion extending from the border between the plurality regions. The partition portion of the membrane is fixed to a slider that can move up and down in a guide groove formed in the membrane supporter. |
申请公布号 |
US7101271(B2) |
申请公布日期 |
2006.09.05 |
申请号 |
US20030739193 |
申请日期 |
2003.12.19 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
MOON JIN-OK |
分类号 |
B24B5/00;B24B1/00;B24B7/00;B24B37/04;B24B37/30;B24B41/06;H01L21/304 |
主分类号 |
B24B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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