发明名称 METHOD AND CONFIGURATION FOR CONNECTING TEST STRUCTURES OR LINE ARRAYS FOR MONITORING INTEGRATED CIRCUIT MANUFACTURING
摘要 A test chip comprises at least one level having an array of regions. Each region is capable of including at least one test structure. At least some of the regions include respective test structures. The level has a plurality of driver lines that provide input signals to the test structures. The level has a plurality of receiver lines that receive output signals from the test structures. The level has a plurality of devices for controlling current flow. Each test structure is connected to at least one of the driver lines with a first one of the devices in between. Each test structure is connected to at least one of the receiver lines with a second one of the devices in between, so that each of the test structures can be individually addressed for testing using the driver lines and receiver lines.
申请公布号 KR20060096045(A) 申请公布日期 2006.09.05
申请号 KR20067007281 申请日期 2006.04.14
申请人 PDF SOLUTIONS, INC. 发明人 HESS CHRISTOPHER;GOLDMAM DAVID
分类号 H01L21/66;G06F 主分类号 H01L21/66
代理机构 代理人
主权项
地址