| 摘要 |
<p>The invention relates to an adhesive film, comprising a blend made of synthetic rubber S1 and thermoplastics 2 which are used to stick electric modules to chip cards. According to the invention, a) the blend is separated into microphases; b) the blend has at least two softening temperatures, wherein at least one softening temperature is higher than 65 degree C and lower than 125 degree C; c) a G' measured according to test method A at 23 degree C is 107 Pas; d) a G" measured according to test method A at 23 degree C is 106Pas; e) and a crossover measured according to test method A is less than 125 degree C.</p> |
