发明名称 Led assembly having overmolded lens on treated leadframe and method therefor
摘要 <p>A base (62) is provided on a lead frame (60). A light emitting diode is installed within a base. The lead frame is treated with base, and a cover is over molded on lead frame to encapsulate light emitting diode to manufacture light emitting diode assembly. An independent claim is included for light emitting diode assembly.</p>
申请公布号 SG124374(A1) 申请公布日期 2006.08.30
申请号 SG20060000364 申请日期 2006.01.19
申请人 BARNES GROUP INC. 发明人 FLAHERTY, EDWARD, M.
分类号 H01L33/52 主分类号 H01L33/52
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