| 摘要 |
A semiconductor chip 1 is provided with a first electrode 2 formed at a first corner of a crystal substrate 1 a generally quadrangular as viewed in plan, and with a second electrode 3 formed to extend along two sides of the crystal substrate 1 a, these sides including between them a second corner located diagonally away from the first corner. The first electrode 2 and the second electrode 3 are connected to a first lead 15 and second leads 16 a , 16 b formed on the circuit substrate 10 via solder paste 20 . The narrow first lead 15 extends transversely to a side of the crystal substrate 1 a, and the second leads 16 a , 16 b extends in the opposite direction to that of the first lead 15 . The first lead 15 and the second lead 16 b are offset from each other by an appropriate distance. With such arrangements, the surface tension of melted solder prevents the semiconductor chip 1 from being fixed to the circuit substrate 10 with a slanting posture. |
