发明名称 |
ADHESIVE FILM FOR SEMICONDUCTOR, LEAD FRAME AND SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE. |
摘要 |
AN ADHESIVE FILM (4) FOR SEMICONDUCTOR, WHICH COMPRISES AT LEAST ONE RESIN LAYER A, AND, AFTER BONDED TO A LEAD FRAME (3), HAS AT 25°C A 90°-PEEL STRENGTH OF AT LEAST 5 N/m BETWEEN THE RESIN LAYER AND THE LEAD FRAME (3), AND, AFTER A LEAD FRAME IS BONDED TO THE ADHESIVE FILM (4) FOR SEMICONDUCTOR AND SEALED WITH A SEALING MATERIAL (7),HAS AT LEAST ONE POINT OF TEMPERATURE RANGING FROM 0 TO 250°C A 90°-PEEL STRENGTH OF AT MOST 1000 N/m BETWEEN THE RESIN LAYER A AND EACH OF THE LEAD FRAME (3) AND THE SEALING MATERIAL (7); A LEAD FRAME (3) AND A SEMICONDUCTOR DEVICE USING THE ADHESIVE FILM (4) FOR SEMICONDUCTOR; AND A METHOD OF PRODUCING A SEMICONDUCTOR DEVICE. (FIG. 5) |
申请公布号 |
MY125771(A) |
申请公布日期 |
2006.08.30 |
申请号 |
MY2000PI05301 |
申请日期 |
2000.11.10 |
申请人 |
HITACHI CHEMICAL CO., LTD. |
发明人 |
TOSHIYASU KAWAI;MATSUURA, HIDEKAZU |
分类号 |
H01L21/60;H01L23/495;C09J7/00;C09J7/02;H01L21/52;H01L21/56;H01L21/68;H01L23/31;H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|