Semiconductor device package and method of manufacturing the same

摘要

A semiconductor device package is provided which can achieve speeding-up thereof. The semiconductor device package includes: a board (16) which has at least one of a ground plane (22) and a power plane (23); at least one connecting conductor portion (25) which is formed on an inner wall surface of an opening portion (21) of the board and electrically connected to the corresponding plane (22 or 23); at least one bonding pattern (26) which is formed on a front surface layer portion of the board in the vicinity of an edge of the opening portion, and connected to the corresponding connecting conductor portion (25); and a second external connection portion (28) which is formed on the side of the front surface layer of the board, and electrically connected to the corresponding plane (22 or 23), respectively, through a through-hole conductor portion (27) formed in the board.