摘要 |
A zero insertion force mount (1) for fixing and making contact with circuit subassemblies (2) on a substrate (3) has a plurality of holding devices (5) for holding the circuit subassemblies (2) and a zero insertion force device (ZIF mechanism) (9), in a stressed state of the zero insertion force device (9), the circuit subassemblies (2) arranged in the holding devices (5) being fixed by means of a pressing force exerted via the contact elements (7). (Fig. 1b)
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