Method and apparatus for detecting defects in wafers

摘要

There is provided a method for inspecting a wafer including a multiplicity of dies, the method comprising dividing an image of at least one portion of the wafer into a plurality of sub-images each representing a sub-portion of the wafer and selecting at least one defect candidate within each of the plurality of sub-images, by comparing each one of the plurality of sub-images to a corresponding sub-image of a reference, comprising a representation which is assumed to be defectless, of the at least one portion of the wafer.