发明名称 |
SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHOD |
摘要 |
<p>The present invention provides a substrate processing apparatus and a substrate processing method suitable for use in an etching apparatus which etches a thin film formed on a peripheral portion of a substrate. The present invention also provides a substrate processing apparatus and a substrate processing method suitable for use in a cleaning apparatus which performs a cleaning process on a substrate which has been etched. The substrate processing apparatus for use in etching includes a substrate holder 11 for holding a substrate W substantially horizontally and rotating the substrate W, and a processing liquid supply unit 15 for supplying a processing liquid onto a peripheral portion of the substrate W, which is being rotated, in such a manner that the processing liquid is stationary with respect to the substrate W. The substrate processing apparatus for use in cleaning a substrate includes a substrate holder 54 for holding a substrate W substantially horizontally and rotating the substrate W, and a cleaning liquid supply unit 53 having a cleaning liquid outlet 53a which is oriented from a center of the substrate W toward a peripheral portion of the substrate W with an elevation angle of not more than 45° from a surface of the substrate W. The cleaning liquid supply unit 53 supplies a cleaning liquid to the surface of the substrate W at a flow velocity of not less than 0.1 m/s.</p> |
申请公布号 |
EP1696475(A1) |
申请公布日期 |
2006.08.30 |
申请号 |
EP20030770027 |
申请日期 |
2003.10.30 |
申请人 |
EBARA CORPORATION |
发明人 |
SAITO, TAKAYUKI;SUZUKI, TSUKURU;YAMADA, KAORU;ITO, KENYA;KAMEZAWA, MASAYUKI;YAMAGUCHI, KENJI |
分类号 |
H01L21/00;B08B3/02;H01L21/02;H01L21/304;H01L21/306 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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