| 发明名称 |
Polishing pad and method of manufacturing semiconductor devices |
| 摘要 |
<p>Disclosed is a CMP pad which is abrasive-free and comprises cells and/or a recessed portion-forming material both having an average diameter ranging from 0.05 to 290 mu m and occupying a region (11) ranging from 0.1% by volume to 5% by volume based on an entire volume of the pad; and an organic material (10). <IMAGE></p> |
| 申请公布号 |
EP1445067(B1) |
申请公布日期 |
2006.08.30 |
| 申请号 |
EP20040001342 |
申请日期 |
2004.01.22 |
| 申请人 |
JSR CORPORATION |
发明人 |
MINAMIHABA, GAKU;TATEYAMA, YOSHIKUNI;YANO, HIROYUKI;KOMURA, TOMOO;HASEGAWA, KOU |
| 分类号 |
B24B37/20;B24B37/24;B24B37/26;B24D3/32;B24D13/14;C08J5/14;C08L3/02;C08L101/00;H01L21/304 |
主分类号 |
B24B37/20 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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