Method of integrating an electronic component into a substrate cavity

摘要

Integration of electronic component (8) into substrate (1) involving:formation of dielectric insulating layers (2,3,4) on substrate front side, complete back etching of substrate region, from the rear side to form cavity (6), arrangement of electronic component (8) on photoresistive layer (7) formed in cavity for adhesion of electronic component, removal of excess layer (7), formation of layer (9) on rear side of substrate for fixing component.