A printed circuit board comprises a plurality of inner and outer holes. An electrically conductive barrel may be disposed in each outer hole, and an electrically conductive barrel and a probe may be disposed in each inner hole. The electrically conductive barrels may protrude from the bottom of the interface board at substantially similar fixed heights. Transfer paths may couple at least some of the barrels in the outer holes to selected barrels in the inner holes.
申请公布号
US7098679(B2)
申请公布日期
2006.08.29
申请号
US20040753142
申请日期
2004.01.07
申请人
HEWLETT-PACKARD DEVELOPMENT COMPNAY, L.P.
发明人
DICK KEVIN R.;BELMORE, III WALTER J.;THOMSEN RODNEY E.;COVINGTON ROBERT R.