| 发明名称 |
Semiconductor chip singulation method |
| 摘要 |
A method to singulate a circuit die from an integrated circuit wafer is achieved. The method comprises providing an integrated circuit wafer containing a circuit die. The integrated circuit wafer is cut through by performing a single, continuous cut around the perimeter of the circuit die to thereby singulate the circuit die.
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| 申请公布号 |
US7098077(B2) |
申请公布日期 |
2006.08.29 |
| 申请号 |
US20040761004 |
申请日期 |
2004.01.20 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
HUANG TAI-CHUN;CHI KUAN-SHOU;YAO CHIH-HSIANG |
| 分类号 |
H01L21/44;H01L21/301;H01L21/46;H01L21/48;H01L21/78 |
主分类号 |
H01L21/44 |
| 代理机构 |
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