发明名称 Non-flammable and non-combustible adhesive bonding systems having adherence to low energy surfaces
摘要 This invention relates to (meth)acrylate based polymerizable compositions and adhesive systems prepared therefrom, which include an initiator system comprising a complex of an organoborane with a complexing agent, an aziridine-containing compound, and a carrier material with which the initiator system is unreactive and which renders the composition having a flash point above 140° F. The inventive compositions desirably have a flash point above 200° F., for each of the parts of the adhesive system. To achieve the physical properties of the inventive compositions and adhesive systems, it is desirable for the carrier material to have such flash points; however, provided that in their entirety the inventive compositions and adhesive systems have such flash points, it is not necessary for the carrier material itself to have such flash points. The inventive compositions and adhesive systems also include a package for controlling the rate of cure and indicating the extent of cure. The inventive compositions and adhesive systems are particularly well suited to bonding applications which involve at least one low energy bonding surface, for example, polyolefin, polyethylene, and polypropylene surfaces.
申请公布号 US7098279(B2) 申请公布日期 2006.08.29
申请号 US20030419250 申请日期 2003.04.21
申请人 HENKEL CORPORATION 发明人 MAANDI EERIK;KNEAFSEY BRENDAN J.
分类号 C08F4/12;B32B27/30;C08F2/00;C08K5/29;C09J4/00;C09J133/02 主分类号 C08F4/12
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