Package for a high-frequency electronic device

摘要

The electronic device comprises a substrate ( 1 ) with a cavity ( 6 ) in which an active device ( 8 ) is present. On the first side ( 2 ) of the substrate an interconnect structure ( 17 ) extends over the cavity and the substrate. On the second side ( 3 ) of the substrate to which the cavity extends, a heat sink ( 23 ) is available. The device is particularly suitable for use at high frequencies, for instance higher than 2 GHz and under conditions of high dissipation.