发明名称 Methods for forming atomic layers and thin films including tantalum nitride and devices including the same
摘要 Atomic layers can be formed by introducing a tantalum amine derivative reactant onto a substrate, wherein the tantalum amine derivative has a formula: Ta(NR<SUB>1</SUB>)(NR<SUB>2</SUB>R<SUB>3</SUB>)<SUB>3</SUB>, wherein R<SUB>1</SUB>, R<SUB>2 </SUB>and R<SUB>3 </SUB>are each independently H or a C<SUB>1</SUB>-C<SUB>6 </SUB>alkyl functional group, chemisorbing a portion of the reactant on the substrate, removing non-chemisorbed reactant from the substrate and introducing a reacting gas onto the substrate to form a solid material on the substrate. Thin films comprising tantalum nitride (TaN) are also provided.
申请公布号 US7098131(B2) 申请公布日期 2006.08.29
申请号 US20040856627 申请日期 2004.05.28
申请人 发明人
分类号 H01L21/4763;C23C16/34;C23C16/44;C23C16/455;H01L21/285;H01L21/768 主分类号 H01L21/4763
代理机构 代理人
主权项
地址