发明名称 Thermal pouch interface
摘要 A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.
申请公布号 US7096926(B2) 申请公布日期 2006.08.29
申请号 US20040831059 申请日期 2004.04.22
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 BELADY CHRISTIAN L;PETERSON ERIC C.;BOUDREAUX BRENT A;HARRIS SHAUN L.;ZEIGHAMI ROY M.
分类号 F28F7/00;F28F23/00;H01L23/433;H05K3/00 主分类号 F28F7/00
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