发明名称 |
Circuit board production method and circuit board production data |
摘要 |
In the process of forming a through-hole or blind-hole at desired positions of a the substrate material, the present invention sets a drilling target position for each hole and a plurality of auxiliary drilling positions at a periphery of the drilling target position, and performs a plurality of drillings at the drilling target position and the plurality of auxiliary drilling positions. In another preferred embodiment of the present invention, a plurality of drillings are performed only at the auxiliary drilling positions per one hole at the desired position. According to the present invention, through-holes or blind-holes having several sizes of diameters can be formed by using one drilling jig under a single drilling condition. Accordingly, it is possible to efficiently produce circuit boards at low costs.
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申请公布号 |
US7097394(B2) |
申请公布日期 |
2006.08.29 |
申请号 |
US20020149202 |
申请日期 |
2002.09.10 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
NISHII TOSHIHIRO;YAMAJI HIROSHI;KIMURA TADAO |
分类号 |
B23B35/00;B26F1/16;B23K26/00;B23K26/06;B23K26/38;B23K101/42;H05K1/02;H05K3/00;H05K3/40;H05K3/42 |
主分类号 |
B23B35/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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