发明名称 Circuit board production method and circuit board production data
摘要 In the process of forming a through-hole or blind-hole at desired positions of a the substrate material, the present invention sets a drilling target position for each hole and a plurality of auxiliary drilling positions at a periphery of the drilling target position, and performs a plurality of drillings at the drilling target position and the plurality of auxiliary drilling positions. In another preferred embodiment of the present invention, a plurality of drillings are performed only at the auxiliary drilling positions per one hole at the desired position. According to the present invention, through-holes or blind-holes having several sizes of diameters can be formed by using one drilling jig under a single drilling condition. Accordingly, it is possible to efficiently produce circuit boards at low costs.
申请公布号 US7097394(B2) 申请公布日期 2006.08.29
申请号 US20020149202 申请日期 2002.09.10
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 NISHII TOSHIHIRO;YAMAJI HIROSHI;KIMURA TADAO
分类号 B23B35/00;B26F1/16;B23K26/00;B23K26/06;B23K26/38;B23K101/42;H05K1/02;H05K3/00;H05K3/40;H05K3/42 主分类号 B23B35/00
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