发明名称 |
Microelectronic assemblies having low profile connections |
摘要 |
A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.
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申请公布号 |
US7098074(B2) |
申请公布日期 |
2006.08.29 |
申请号 |
US20030699328 |
申请日期 |
2003.10.31 |
申请人 |
TESSERA, INC. |
发明人 |
WARNER MICHAEL;BEROZ MASUD;LIGHT DAVID;LI DELIN;CASTILLO DENNIS;WANG HUNG-MING;SMITH JOHN W. |
分类号 |
H01L21/44;H01L21/48;H01L21/50;H01L23/31;H01L23/485;H01L23/498;H01L23/538 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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