发明名称 |
Apparatus for bonding a chip using an insulating adhesive tape |
摘要 |
In an embodiment of the invention an apparatus is configured to stack a plurality of semiconductor chips having the same or similar size. The apparatus includes a tape providing unit for providing an insulating adhesive tape, a tape attaching device for attaching the insulating adhesive tape to an area between electrode pads of a first chip, and a chip attaching device for attaching a second chip to the insulating adhesive tape.
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申请公布号 |
US7096914(B2) |
申请公布日期 |
2006.08.29 |
申请号 |
US20030629937 |
申请日期 |
2003.07.29 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM DONG-KUK;KIM MIN-IL;LEE SANG-YEOP;LEE CHANG-CHEOL |
分类号 |
H01L21/44;H01L25/18;H01L21/52;H01L21/58;H01L21/98;H01L23/12;H01L25/065;H01L25/07 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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