发明名称 Thin capacitive structure
摘要 A capacitor structure in a semiconductor device is provided. The capacitor structure includes a first power rail on a topmost level of the semiconductor device, and a second power rail on the topmost level of the semiconductor device. The capacitor structure also includes a dielectric layer disposed over at least a portion of one of the first power rail and the second power rail. The capacitor structure further includes a conductive layer disposed over and between the first power rail and the second power rail where the conductive layer is in electrical contact with the power rail not having the dielectric layer, and the conductive layer is disposed over the dielectric layer.
申请公布号 US7098501(B2) 申请公布日期 2006.08.29
申请号 US20030360267 申请日期 2003.02.05
申请人 SUN MICROSYSTEMS, INC. 发明人 KONG WEIRAN;HO BERNARD;GREENHILL DAVID;BOBBA SUDHAKAR
分类号 H01L27/04;H01L27/108;H01L21/02;H01L21/768;H01L21/822;H01L23/522;H01L23/528;H01L29/76;H01L29/94 主分类号 H01L27/04
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