发明名称 High impedance thermal shutdown circuit
摘要 A thermal shutdown circuit board integrated circuit device. The thermal shutdown circuit includes a current source for receiving a current bias and generating an output current in accordance therewith. The current source is configured to produce the output current in a manner proportional to absolute temperature. A current mirror is coupled to the current source. The current mirror is configured to mirror the output current from the current source and is configured to have a high output impedance. A thermal shutdown transistor is coupled to control one output of the current mirror. The thermal shutdown transistor is also coupled to receive the output current and shutdown the output current at a temperature threshold in a manner dependent on shutdown circuit operating temperature.
申请公布号 US7098720(B1) 申请公布日期 2006.08.29
申请号 US20020290714 申请日期 2002.11.08
申请人 NATIONAL SEMICONDUCTOR CORPORATION 发明人 DOW RONALD NEAL
分类号 G05F3/26;G05F3/22 主分类号 G05F3/26
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