METHOD OF SUPERPOSING AND SEALING A SUBSTRATE

摘要

While interlocking with the operation of an electrostatic attraction means (5b) for releasing an upper substrate (A), gas (G) is jetted from the back side of the upper substrate and injected forcibly between the electrostatic attraction face (5b1) of an upper holding plate (1) and the back surface of the upper substrate. Since adhesion state of the electrostatic attraction face and the substrate surface is broken and they are stripped from each other, electrostatic attraction between them is attenuated forcibly and eliminated. Since a falling force or a falling acceleration acts forcibly on a lower substrate (B) due to the pressure of injected gas, the upper substrate adheres onto the lower substrate instantaneously. The upper substrate is moved, while being held by the electrostatic attraction means (5b), onto the lower substrate without varying the attitude, and bonded and stacked thereon while being sealed. The upper substrate can thereby be dropped forcibly while being aligned regardless of variation in the electrostatic attraction being released.