SURFACE ACOUSTIC WAVE DEVICE, PACKAGE FOR THE DEVICE, AND METHOD OF FABRICATING THE DEVICE

摘要

A surface acoustic wave device includes a surface acoustic wave chip having a piezoelectric substrate on which comb-like electrodes and electrode pads are formed, and a package housing the surface acoustic wave chip, a first surface of the package including an opening of the cavity being wider than a second surface of the package opposite to the first surface.