socket for protecting over-heating of a semiconductor package,申请号KR20000005202-传众专利搜索

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发明名称	socket for protecting over-heating of a semiconductor package
摘要
申请公布号	KR100615463(B1)	申请公布日期	2006.08.25
申请号	KR20000005202	申请日期	2000.02.02
申请人		发明人
分类号	H01L23/34	主分类号	H01L23/34
代理机构		代理人
主权项
地址

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