发明名称 Copper powder
摘要 A copper powder that is excellent in weatherability and adapted for use in conductive paste is provided that contains 10-20,000 ppm, preferably 100-2,000 ppm, of Sn. The copper powder is particularly preferably one having an average particle diameter DM of 0.1-2 mum and, further, one wherein the particle diameter of at least 80% of all particles is in the range of 0.5 D<SMALLCAPS>M</SMALLCAPS>-1.5 D<SMALLCAPS>M</SMALLCAPS>. This copper powder can be produced, for example, by precipitating Cu metal by reduction of Cu ions in the presence of Sn ions.
申请公布号 US2006185474(A1) 申请公布日期 2006.08.24
申请号 US20060355888 申请日期 2006.02.17
申请人 发明人 YAMADA TOMOYA;HIRATA KOJI
分类号 C22C9/00 主分类号 C22C9/00
代理机构 代理人
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