Probe for measuring electrical characteristics of integrated circuit, microelectronic device, has conductive via formed between front and back surfaces of dielectric substrate, in thickness direction
摘要
<p>A dielectric substrate (88) has a conductive via between front and back surfaces in thickness direction, without forming an air gap between the conductive via and the substrate end and without electrical interconnection with a conductive shield covering the major area of the conductive signal trace (92) supported on upper surface of substrate. A contact is electrically connected to the conductive via.</p>
