| 摘要 |
<p>Method and apparatus are disclosed for direct measurement of the tensile strength of solder joints with use of laser spallation. A laser pulse (24) is directed at a surface in communication with the solder joint, generating a stress wave to separate the solder ball (102)/(118) from its underlying structure. The solder joint may be measured either prior to joining of PCB board (86) or CSP package (90), or after they have been joined. The joint for testing may be prepared by polishing either the PC board or CSP package to expose the desired solder joint for testing. The tensile strength of the embedded solder joints may also be measured in-situ.</p> |
