| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a substrate with a bump capable of forming the high bump and capable of easily controlling the height of the bump. <P>SOLUTION: The substrate is prepared in which a first conductive foil 12 is stuck on a top face first and a second conductive foil 13 is stuck on an underside, and a through-hole 14 is formed. The first conductive foil 12 and the second conductive foil 13 are connected electrically through the through-hole 14, and the through-hole 14 is filled with fillers 16. A conductive path extending from a bump 18 is formed by forming the bump 18 by etching the first conductive foil 12, and etching the first conductive foil 12 excepting a place where the bump 18 is formed. Accordingly, the height of the bump 18 can be controlled by controlling the thickness of the first conductive foil 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
