| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin-sealed semiconductor device that has stable electrical characteristics and superior high-frequency characteristics, even if its size is made small and thinned, and to provide its manufacturing method. <P>SOLUTION: The resin sealed semiconductor device includes a die pad 106; a signal lead 102; an earth connection lead 103 connected to the die pad 106; a semiconductor chip 201, having an earth electrode pad, a metal fine wire 202; and a sealing resin 203 for sealing the die pad 106 and the semiconductor chip 201, and for sealing the signal lead 102 and the earth connection lead 103, in a state where their lower sides are exposed as external electrodes. Since the grounding connection lead 103 is connected to the grounding electrode pad, the resin-sealed semiconductor device is electrically stabilized. Moreover, by the die pad 106 and the grounding connection lead, interferences among the high-frequency signals passing through the signal lead 102 is suppressed. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
