发明名称 |
Semi-conductor die mount assembly |
摘要 |
A die mount assembly including a semiconductor die and die mount is provided. The semiconductor die may be a light emitting diode die that is attached to the die mount forming an electrical and thermal connection. The die mount includes a first set of pads and a second set of pads. A first pad of the first set of pads is connected to a second pad of the second set of pads through a plurality of vias. The vias comprise an electrically and thermally conductive material that connect the first pad to the second pad through a substrate.
|
申请公布号 |
US2006186535(A1) |
申请公布日期 |
2006.08.24 |
申请号 |
US20050063916 |
申请日期 |
2005.02.23 |
申请人 |
VISTEON GLOBAL TECHNOLOGIES, INC. |
发明人 |
BAKER JAY D.;KNEISEL LAWRENCE L.;REDDY PRATHAP A. |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|